| 摘要 |
Provided is a semiconductor device with which the total thickness of a laminate structure can be controlled to a constant value, even in cases of, e.g. tolerance-based variations in thickness of the laminated components. This semiconductor device 1 has a laminated structure 2 composed of a plurality of laminated component parts 20, 30, 40, 50, 60. The laminated structure 2 has an adhesive layer 30 which is bonded between the first component part 20 and the second component part 40, and which is reduced in thickness through plastic deformation induced by compression in the thickness direction. |
