| 发明名称 |
Printed circuit board copper plane repair |
| 摘要 |
A device has a base with a mounting surface with a length and a stack, the stack having a diameter smaller than the length and fastened to the mounting surface. The stack may have a plurality of stack conductive layers in addition to a plurality of insulating layers that separate each of the plurality of stack conductive layers. The stack conductive layers may be separated in a manner that aligns them with corresponding printed circuit board conductive layers when the stack portion of the device is inserted into an aperture in a printed circuit board. |
| 申请公布号 |
US9374910(B2) |
申请公布日期 |
2016.06.21 |
| 申请号 |
US201314145190 |
申请日期 |
2013.12.31 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Bohra Mahesh;Chun Sungjun;Montanez Jesus;Rodriguez Daniel I. |
| 分类号 |
H05K1/11;H05K1/09;H05K1/16;H05K3/32;H05K1/02;H05K3/00;H05K3/22;H05K1/18 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
Wilhelm Richard A.;Petrokaitis Joseph |
| 主权项 |
1. A device, comprising:
a base having a mounting surface with a length; and a stack having a first diameter smaller than the length and fastened to the mounting surface and having
a plurality of stack conductive layers, anda plurality of insulating layers separating each of the plurality of stack conductive layers in a manner configured to align the plurality of stack conductive layers with corresponding printed circuit board conductive layers in a printed circuit board when the stack is inserted into an aperture within the printed circuit board. |
| 地址 |
Armonk NY US |
