| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutting device of a wafer capable of suppressing as much as possible an increase in installation area in association with an increase in size of the wafer, and suppressing as much as possible the occurrence and shipment of defective products.SOLUTION: A cutting device 1 includes: support means 2 having a support surface 22 for supporting a wafer WF from a rear face side; cutting means 3 for cutting the wafter WF with a rotary blade 33 from a front surface WFA side; and moving means 4 for relatively moving the support member 2 and the rotary blade 33 to cut the wafer WF into a predetermined shape. The support surface 22 is an intersection face that intersects with a horizontal surface, and the moving means 4 relatively moves the support means 2 and the rotary blade 33 in a direction parallel with the support surface 22. |
