LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, LIGHTING DEVICE AND ITS MANUFACTURING METHOD

摘要

The present invention relates to a light emitting device package which can be used for display or lighting, a backlight unit, a lighting device and a method for manufacturing the light emitting device package. The method may include a substrate preparing step of preparing a substrate where a first electrode is formed on one side based on an electrode separation line and a second electrode is formed on the other side; a mixed paste spraying step of spraying mixed paste where a bonding medium of a conductive material is mixed with an underfill medium of an insulating material, to the first electrode and the second electrode of the substrate; a light emitting element mounting step of mounting a light emitting element of a flip chip type to mount the first pad and the second pad on the mixed paste; and a reflow step of reflowing the mixed paste. So, an underfill process can be omitted.