| 摘要 |
PROBLEM TO BE SOLVED: To finish a wafer into a sectional shape with a high flatness while offsetting influence due to flectional deformation. SOLUTION: When a wafer W held between a lower plate 1 and an upper plate 2 is machined by relatively rotating the lower plate 1 and the upper plate 2 while applying the dead weight of the upper plate 2, weight distribution in the radial direction is given to the upper plate 2 for offsetting the non-uniformity of a machining load on the wafer W resulting from the flectional defomation of the upper plate 2. The weight distribution given to the upper plate 2 preferably corresponds to the distribution of a contact area rate R between the upper plate 2 and the wafer W along the radial direction of the upper plate 2. |
