| 摘要 |
The present invention relates to a method for bonding two substrates (1, 2). The method includes the following steps: applying a bonding agent (4) on the first substrate (1); partially indurating the bonding agent (4); and applying the bonding agent (4) to the second substrate (2). Before the bonding agent (4) is completely indurated, the second substrate (2) is applied onto the bonding agent (4). According to the present invention, pressure peaks can be repressed. |
