| 摘要 |
PURPOSE:To reduce defects such as a short circuit in soldering by a soldering reflow method while facilitating the positioning of bodies to be soldered together, by using solder in such a shape that it coincides the bodies to be soldered. CONSTITUTION:When lead terminals, etc., of an integrated circuit 1 are soldered to the pattern, etc., of a printed board 3, solder 20 in a shape coinciding to the bodies 1 and 3 to be soldered is sandwiched between them, and they are heated and melted to perform the soldering. The body 1 coincides the solder 20 and the solder 20 engages the body 3, so the body 1 hardly shifts from the body 3 horizontally, thereby easily positioning the bodies 1 and 3. |
