发明名称 Soldering apparatus
摘要 In a method and apparatus for soldering or tinning wires or component leads, solder is pumped through a nozzle to form a downwardly flowing stream. The wire or lead is passed laterally into the stream and then withdrawn axially to leave a coating of solder on the wire. The wire or lead is angled to the horizontal, pointing upwardly in the direction of withdrawal from the stream.
申请公布号 US4873938(A) 申请公布日期 1989.10.17
申请号 US19860878776 申请日期 1986.06.26
申请人 CINIGLIO, ALEXANDER J. 发明人 CINIGLIO, ALEXANDER J.
分类号 H01R43/02;B23K1/08;B23K3/06 主分类号 H01R43/02
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