Epoxy] resin used in sealing semiconductor building elements - comprising epoxy] resin, phenolic hardening agent, organo phosphor-hardening catalyst, aluminium oxide and sepg. agent

摘要

An epoxy resin compsn. (I) comprises (i) an epoxy resin; (ii) a phenolic hardener; (iii) an organophosphorus-hardening accelerator; (iv) aluminium oxide; and (v) a separating agent to separate (iii) and (iv). Also claimed are: (a) an epoxy resin compsn. as (I) except that (iv) is coated with a coating agent, and epoxy-modified silane coupling agent, a silicon resin or a ceramic material; (b) an epoxy resin compsn. comprising (i), (ii), (iii) a complexed organophosphorus hardening accelerator hardening accelerator and (iv); and the hardened prod. of the above compsns. USE/ADVANTAGE - The compsn. is useful in the sealing of ICs, LSIs, transistors, thyristors, diodes and other semiconductor building elements. It has improved moisture resistance, heat stability i.e. high Tg, electrical characteristics and heat conductivity, and good storage stability. The hardened prod. has good electrical, mechanicl and chemical characteristics, moisture resistance etc