Component system for bonding and method of bonding enabling thermal dilatations

摘要

A component (110) that is to be connected presents a number of connection pads (114a) that may receive soldering balls. A second component (112) is provided with similar pads (114b). The pads are grouped in pairs, with each pad having a different dilation coefficient. The pads are positioned at a distance d1(i), d2(i) relative to the centre (B). These distances are functions of the dilation coefficients and temperature.