| 摘要 |
Method for encapsulating an integrated semiconductor circuit (die) comprising the following steps: a) mounting the semiconductor circuit onto the supporting surface of a so-called lead frame, b) attaching connecting wires between the contact pads of the semiconductor circuit and selected parts of the lead frame (bonding), c) producing a plastic package by means of a mould, which package surrounds at least the semiconductor circuit, the supporting surface, the connecting wires and part of the lead frame. According to the invention between the steps b) and c) the additional step is carried out: d) supplying a predetermined volume of radiation transparent plastic at that side of the semiconductor circuit opposite the side which is attached to the supporting surface, which plastic has a glass temperature lower than the temperature which is used for carrying out step c). <IMAGE> |
