MOUNTING STRUCTURE FOR ELECTRONIC COMPONENT ONTO WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a mounting structure for an electronic component onto a wiring board in which reliability of mounting is improved by rigidly joining an organic resin filler to the wiring board and the electronic component. SOLUTION: In this mounting structure, an electronic component A is mounted on a wiring board made of an organic resin which has a wiring conductor layer 3 and has a bonding pad 10 formed on the surface thereof, the bonding pad 10 being electrically connected with the wiring conductor layer 3. The bonding pad 10 and an electrode a formed on the lower surface of the electronic component A are connected with each other via a conductive junction member 11, and an organic resin filler 12 is filled between the surface of the wiring board and at least the lower surface of the electronic component A. In this case, the organic resin filler 12 contains an insulating filler, and the content of this insulating filler is large on the side of the electronic component A and small on the side of the wiring board.