| 摘要 |
PROBLEM TO BE SOLVED: To firmly adhere and fix a via-inductor to the inner surface of a via-hole and to form a fine structure by constituting the via-conductor with a sintered body consisting of a conductive material and two types of insulation inorganic materials with different sintering starting temperatures. SOLUTION: In an inorganic multilayered substrate 5, a visa conductor 1 is formed in a via hole 2 that is penetrated through, is formed at each insulating layer 4 and is electrically connected to conductor layers 3 and 3 being wired to the surface of the insulation layer 4. The via-conductor 1 is formed in a via hole due to debinding by filling the mixture of a conductor material powder and two types of inorganic material powders into the via-hole of the non-baked insulation layer 4 in the form of paste, is backed along with the insulation layer 4, and is formed into a sintered body. At this point, a first inorganic material in the via-conductor 1 is selected from a material whose sintering starting temperature is essentially the same as that of the inorganic insulation material for the insulation layer 4, and is selected form a material with a higher sintering starting temperature than that of the insulation material, thus forming a via-conductor with improved adhesion property with the via-hole. |
