SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To facilitate boring of connection holes for connecting different wiring layers and burying a conductor film. SOLUTION: At peripheral circuit regions of DRAM, connection holes for electrically connecting a first layer wiring 14 and a second layer wiring 26 are twice bored to form connection holes 17a, 17b, and, after forming the connection holes 17a, 17b, plugs 18a, 25a are formed in the respective connection holes 17a, 17b.