| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin encapsulating method of a substrate for manufacturing a semiconductor device, in which peeling performance of unwanted resin from a substrate for manufacturing the semiconductor device after resin encapsulation is improved, and manufacturing cost is reduced by simplifying a substrate manufacturing process. SOLUTION: A resin encapsulation method of a substrate for manufacturing a semiconductor device 10 is provided in which a substrate 10 for manufacturing a semiconductor device, on one face of which a semiconductor element is loaded, and on the other face of which a solder ball is formed, is carried to an opened molded die parting face, and is resin encapsulated. A release film 31 is extended so as to be adhered on a parting face from a molded die pot 16 to a side edge 13a of a cavity 13. Then, the substrate 10 for manufacturing the semiconductor device is carried to the molded die parting face, and while a resin path for packing resin from one side 10a of the substrate 10 for manufacturing the semiconductor device to the side edge 13a of the cavity 13 is covered with the release film 31, the substrate 10 for manufacturing the semiconductor device is clamped and resin encapsulated by the mold die. |
