| 摘要 |
PROBLEM TO BE SOLVED: To improve soldering performance at the mounting by a simple work without any work requiring man-hours for operating solder plating to a lead exposed after molding, while maintaining moisture resistance between the lead and a package. SOLUTION: The electrodes of an electronic component chip are electrically connected with the top end parts of leads 4 and 5, and the electronic component chip and the top end parts of the leads 4 and 5 are covered by a package 3, and the leads 4 and 5 extended from the package 3 to the outside part are bent along the outside wall of the package 3. Then, solder bumps 6 with a low fusing point are held at a clearance part between the leads 4, 5 and the package 3. |
