发明名称 |
Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board |
摘要 |
In a method of production of a multichip package module, rough-pitch bare chips are positioned at first locations on a printed-circuit board, and the rough-pitch bare chips are temporarily attached to the board at the first locations. The rough-pitch bare chips are mounted on the board at the same time by applying heat and pressure to the rough-pitch bare chips simultaneously. A respective one of fine-pitch bare chips is positioned at a respective one of second locations on the board other than the first locations, and the respective one of the fine-pitch bare chips is mounted on the board by applying heat and pressure to the fine-pitch bare chips individually, in order to produce the multichip package module.
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申请公布号 |
US6006426(A) |
申请公布日期 |
1999.12.28 |
申请号 |
US19980026490 |
申请日期 |
1998.02.19 |
申请人 |
FUJITSU LIMITED |
发明人 |
KIRA, HIDEHIKO;KOBAE, KENJI;KAINUMA, NORIO;ISHIKAWA, NAOKI;EMOTO, SATOSHI |
分类号 |
H01L21/56;H01L21/58;H01L21/60;H01L21/603;H01L25/04;H01L25/18;(IPC1-7):H05K3/30 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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