| 摘要 |
<p>PROBLEM TO BE SOLVED: To assure flatness by utilizing a member used in a mounting/assembly process, omitting an expansion stiffener. SOLUTION: A first process where a semiconductor chip and a substrate 10, where a wiring pattern 20 comprising a first region 12 and a second region 14 adjacent to it is formed are prepared, a second process where the semiconductor chip is mounted in the first region 12, a third process where the second region 14 is pasted in the part of the first region 12 except for the mounting region for the semiconductor chip while the first and second regions 12 and 14 are connected, and a process where an external terminal is provided further outside than the semiconductor chip-mounting region in the first region 12, are provided.</p> |
