SUBSTRATE-HOLDING CHUCK, MANUFACTURE THEREOF, EXPOSURE METHOD, MANUFACTURE OF SEMICONDUCTOR DEVICE AND ALIGNER

摘要

PROBLEM TO BE SOLVED: To hold a substrate without impairing the planarity of the substrate, when the substrate of a silicon wafer, etc., is vacuum chucked. SOLUTION: A pin contact substrate holding chuck is composed of a glass substrate 10. This substrate holding chuck 10 is formed by providing a rugged surface on the glass substrate which is polished in a highly precise manner. The rugged surface consists of an auxiliary holding body 2, a first annular wall body 3 and a second annular wall body 4.