SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device in which the temperature of a semiconductor element can be detected precisely by reducing the detection temperature difference between the temperature of the semiconductor element and the temperature of a thermistor. SOLUTION: The semiconductor device is formed, in such a way that an external cooling fin and an insulating substrate comprising metal layers fixed and bonded to main faces on both sides are bonded via a support substrate fixed and are bonded to the main face on one side of the insulating substrate. In the semiconductor device, the semiconductor element and a temperature detecting body are electrically connected to the metal layer fixed and are bonded to the main face on the other side of the insulating substrate.