Highly reactive modified phenolic resin and molding material for electrical/electronic parts and semiconductor sealing material

摘要

Disclosed is a process for producing a highly reactive modified phenolic resin, which comprises mixing a heavy oil or pitch with 0.3 to 10 mol of a phenol, 0.2 to 9 mol in terms of formaldehyde, of a formaldehyde compound and 0.01 to 3.0 mol of an acid catalyst, each amount being based on 1 mol of the heavy oil or pitch calculated from an average molecular weight; and heating the resulting mixture with stirring, thereby to polycondensate the heavy oil or pitch, phenol and formaldehyde compound. According to this invention, there can be provided a process for producing simply and stably a highly reactive modified phenolic resin having low melt viscosity, excellent heat resistance and high reactivity with an epoxy resin, in one step.