发明名称 Method of forming a high dielectric film
摘要 A method of forming a high-K dielectric film by the MOCVD method using an amine-based organic metal compound precursor is disclosed. According to the present method, a precursor gas including organic metal compound molecules of the amine-based organic metal compound precursor is supplied to a processing space that accommodates a substrate to be processed, the surface of the substrate being exposed so that the amine-base organic metal compound molecules are chemically adsorbed onto the surface of the substrate. Then, a hydrogen gas is supplied to the surface of the substrate, and an oxidization gas is introduced into the processing space to thereby form the high-K dielectric film on the surface of the substrate.
申请公布号 US2005170665(A1) 申请公布日期 2005.08.04
申请号 US20050098395 申请日期 2005.04.05
申请人 FUJITSU LIMITED 发明人 SUGITA YOSHIHIRO
分类号 C23C16/40;C23C16/455;H01L21/316;H01L21/8242;(IPC1-7):H01L21/824;H01L21/31 主分类号 C23C16/40
代理机构 代理人
主权项
地址