| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module whose power elements are uniformly cooled down, and also provide semiconductor device. SOLUTION: Electrode plates 52 and 54, which function as a heat sink, are arranged such that they shut in a power transistor Q1 and a diode D1 from both sides. The surface(s) of the electrode(s) 52 (and 54) facing a cooling body 62 (and 64) is formed such that in places where they face the power transistor Q1 and diode D1, the thickness of their part facing the approximately central part of the power transistor Q1 or the diode D1 is thinner than those of their parts facing the peripheral parts. In addition, the cooling bodies 62 and 64 are disposed such that they shut the electrode plates 52 and 54 in from both sides, respectively, in accordance with their profiles. COPYRIGHT: (C)2006,JPO&NCIPI |
