发明名称 |
INSULATING SHEET, METALLIC LAYER AND INSULATING SHEET LAMINATE, AND PRINTED WIRING BOARD USING SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide an insulating sheet which can be preferably used for manufacturing a printed wiring board and the like, shows excellent adhesion to a metallic layer formed on a surface of the sheet even if the surface roughness of the sheet is small, has small coefficient of linear expansion and shows excellence in the uniformity of insulation thickness between layers and the reliability of insulation between layers in a fabricated multi-layered printed wiring board, and to provide its typical utilization technique. SOLUTION: The insulating sheet is characterized in that a layer B containing a thermoplastic polyimide resin having a specific structure is formed on one surface of a non-thermoplastic polyimide film layer A, and in that a layer C containing a thermoplastic polyimide resin and a thermosetting component is formed on another surface of the film layer. COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2006224644(A) |
申请公布日期 |
2006.08.31 |
申请号 |
JP20050078093 |
申请日期 |
2005.03.17 |
申请人 |
KANEKA CORP |
发明人 |
NISHINAKA MASARU;SHIMOOOSAKO KANJI;TANAKA SHIGERU;ITO TAKU;MURAKAMI MUTSUAKI |
分类号 |
B32B27/34;B32B7/02;B32B15/088;B32B27/00;H01B17/56;H05K1/02;H05K1/03;H05K3/38 |
主分类号 |
B32B27/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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