| 摘要 |
PROBLEM TO BE SOLVED: To concurrently carry out a thermocompression bonding step in which an IC chip is compression-bonded by curing thermosetting adhesive and a sealing step, and to shorten a time required for fixing the IC chip. SOLUTION: A hot melt adhering sheet 9 is coated on an IC chip 4 arranged in a chip fitting region 2 of a conductive pattern via thermosetting adhesives 3, and in a state of coating the hot melt adhering sheet 9, the IC chip 4 is thermocompression-bonded to the chip fitting region 2. By this thermocompression-bonding steps, the IC chip 4 are sealed with the hot melt adhering sheet 9 melt. |
