Method for providing servo motor rear bearing support, space for internal electronic packaging and IP sealing between motor and externally attached devices

摘要

An electric motor assembly that eliminates external component-to-component assembly seams between coupled packaging hardware that would inhibit the creation and maintenance of, for example, IP 66 and IP 67 seals while utilizing inexpensive existing motor shaft rear bearing supports and also creating additional internal electronic packaging space. The disclosure provides an assembly with a continuous (e.g., no interruptions or seams) surface area to support IP sealing of the entire packaging-to-package interface between a primary motor frame (e.g., housing) and externally attached secondary/ancillary electronic hardware.

主权项

1. A motor assembly comprising:
a tubular motor housing having an interior chamber extending between first and second ends, the tubular motor housing having an opening in an exterior surface thereof; a motor unit received in a first end of the chamber, the motor including an output shaft having opposite axial ends, with at least one of the axial end of the output shaft terminating within the housing; a bearing support received in the second end of the chamber, the bearing support including a bearing supporting the axial end of the output shaft terminating within the housing, the bearing being spaced axially inward from the second end of the chamber; and an electronics module supported on an exterior surface of the housing; wherein the housing includes an external flange extending along a major portion of a length thereof, the flange having a continuous planar sealing surface surrounding the opening and including a heat transfer material supported thereon adjacent the opening, the opening extending from an exterior of the housing to the interior chamber through which the electronics module extends for connection to at least one of the motor or the bearing support, the continuous planar sealing surface adapted to interface with a corresponding sealing surface of the electronics module to form a seal therebetween surrounding the opening and the heat transfer material, whereby the opening and the heat transfer material is shielded from contaminants.