| 摘要 |
PROBLEM TO BE SOLVED: To enable the formation of bumps at a low cost to a semiconductor device, such as a bumpless IC chip, the bumps being capable of achieving stable conduction reliability.SOLUTION: In a film for forming bumps, conductive fillers for a bump are regularly arranged in plan view within an insulating adhesive resin layer. The regular arrangement has a periodically repeating unit in the longitudinal direction of a film, and a straight line connecting one end portions of the conductive fillers for a bump in the thickness direction of a film is substantially parallel to the surface of a film.SELECTED DRAWING: Figure 1 |
