| 摘要 |
Provided is a circuit assembly having a new structure in which a busbar circuit unit overlapped with a printed circuit board can reliably be fixed regardless of the heating temperature at the time of soldering of an electrical component. In a circuit assembly 10 in which a busbar circuit unit 16 constituted by a plurality of busbars 14 is overlapped with a printed circuit board 12 having a printed wiring 48 and is fixed thereto via an adhesive sheet 20, the plurality of busbars 14 are adhered to the surface of the adhesive sheet 20 in a state in which the busbars 14 are arranged adjacently and spaced apart by gaps, and the gaps 22 between the busbars 14 are filled with the adhesive agent 24. With the adhesive agent 24, press-cut surfaces 30 of the busbars 24 and at least one of the adhesive sheet 20 and the printed circuit board 12 that is exposed from the gaps 22 between the busbars 14 is adhered. |
