Wafer level packaged optical subassembly and transceiver module having same

摘要

An optical subassembly includes: a TSV submount layer carrying an active optical component and a sandwich cap bonded to the TSV submount layer. The sandwich cap includes a bottom spacer layer disposed above the TSV submount layer, a glass layer above the bottom spacer layer, and an upper spacer layer above the glass layer. A cavity is defined in the bottom spacer layer and configured for accommodating the active optical component. At least one first lens is formed on the glass layer and is opposite to the active optical component. An alignment feature is formed in the upper spacer layer.

主权项

1. An optical subassembly comprising:
a TSV submount layer carrying an active optical component; and a sandwich cap bonded to the TSV submount layer; wherein: the sandwich cap comprises a bottom spacer layer disposed above the TSV submount layer, a glass layer above the bottom spacer layer, and an upper spacer layer above the glass layer; a cavity is defined in the bottom spacer layer and configured for accommodating the active optical component; at least one first lens is formed on the glass layer and is opposite to the active optical component; an alignment feature is formed in the upper spacer layer; and the TSV submount layer comprises a structure with a first hole with metal deposited surrounding and a second hole filled by metal to achieve a hermetic package by sealing a silicon through via in the TSV submount layer.