| 摘要 |
PURPOSE:To protect pellets from cracks or warp for improvement in their voltage-withstanding capability and for the attainment of a good yield by a method wherein a laser beam is applied to produce grooves in a heated semiconductor element wafer provided with P-N junctions for segmentation into a plurality of pellets. CONSTITUTION:A laser device 7 emits a laser beam 1, which lands on a segmentation line A or B in a semiconductor element wafer 2. The semiconductor element wafer 2 is fixed secure in a supporting bed 4, turns around in a direction 8 at a prescribed rate, and is subjected to segmentation by the laser beam 1. The supporting bed 4 is provided with a heater 3, which heats the entirety of the semiconductor element wafer 2. In this way, a semiconductor element wafer is protected from cracks or warp and is improved in its voltage- withstanding feature, which ensures a better yield. |
