| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that the characteristics of a hard disk itself are greatly affected by temperature increase of an IC for read, write, and amplification, and by greatly decreasing read and write speed since heat radiation properties in the IC for read, write, and amplification are poor although an FCA where the IC for read, write, and amplification is stuck is packaged in the hard disk. SOLUTION: The back of a semiconductor device 16 is exposed onto the back of an insulating resin 13, and a metal plate 23 is stuck onto the back of the semiconductor device. The back of the metal plate 23 is essentially flush with the back of a flexible sheet, and can be easily stuck to a second support member 24, thus excellently radiating heat generated from the semiconductor device via the metal plate 23 and second support member 24. |
