| 摘要 |
PURPOSE:To correct the dispersion of the positions of through-holes due to the dispersion of a shrinkage factor at the time of baking by forming the through-holes shaped to a green sheet as an uppermost layer along radial lines having an origin in the central lower section of the green sheet, polishing a surface after baking and adjusting the positions. CONSTITUTION:Through-holes 3 are formed vertically to the surfaces of green sheets 1-1-1-n-1 except an uppermost layer, but the through-holes 3 in the green sheet 1-n as the uppermost layer are shaped along a radial line 4 having an origin 0 in the central lower section of the green sheet 1-n. Consequently, the inclination of the through-holes 3 is increased with separation from the center of the green sheet. A substrate is baked, and errors are generated to a design value in the position of the through-holes 3 by the dispersion of the shrinkage of the substrate, but the top face of the green sheet 1-n can be employed as it is when shrinkage is most increased, and the green sheet 1-n is polished up to the underside of the green sheet and the green sheet 1-n is used when shrinkage is most reduced. Accordingly, when polishing is stopped when through- holes are shaped at desired intervals, the intervals of the through-holes due to shrinkage at the time of baking can be corrected. |
