| 摘要 |
PURPOSE:To cool a wafer so efficiently, by installing an electristatic chuck electrode in upper and lower surfaces of a tray, impressing DC voltage from an electric conductor of a water cooled electrode, and clamping the tray and the wafer as well as the tray and the water cooled electrode to an electrostatic chuck. CONSTITUTION:The wafer 20 mounted on a tray 19 is conveyed to the inside of a vacuum vessel 1, and mounted on a pin 18 piercing through a flat plate part of a lifting shaft 6 and an electrode 8. And, this lifting shaft 6 is made to go up, and the tray 19 is mounted on the electrode 8, while a peripheral edge of the tray 19 is made contact with a projecting part 2 of the vessel 1 and pressed thereto. Under this state, a conductive spring 14 and an electrostatic chuck electrode 23 of the tray 19 are made contact with each other. At this time, DC voltage is impressed via an electrostatic wire 17, and the wafer 20 is clamped to the tray and, in turn, the tray onto the electrode 8 electrostatically, respectively. Thus, the tray 19 is positively clamped to a water cooled electrode 8, thus positive cooling for the wafer 20 is performable. |
