| 摘要 |
<p>PURPOSE:To improve printability by bonding a top face plate, to which a stepped through-hole is formed, with the top face of an underside plate and forming a stepped recessed section for holding an IC. CONSTITUTION:Four-color processes are conducted onto the surface of a rigid polyvinyl chloride blank sheet 41 having specified size and thickness, and a through-hole 411 having specified size, into which an IC chirp 1 is fitted, is press-cut. A through-hole 421 having fixed size is formed to the rigid polyvinyl chloride blank sheet 142 having the same size and thickness. Both sheets 41, 42 are bonded by solvent adhesives for rigid polyvinyl chloride while each through-hole 411, 421 is aligned. Consequently, a top face plate 4 with a through- hole 22 with a step 21 is shaped. A printing-worked underside plate 3 having fixed size and thickness is bonded with the top face plate 4 with the same adhesives. The outer circumference of a card is trimmed and worked, thus forming an IC card base material.</p> |
