| 发明名称 |
METHOD FOR PRODUCING COMPONENT SURROUNDED WITH PLASTIC AND COMPONENT SURROUNDED WITH PLASTIC |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a component, which can be produced by a known production method as easily as possible, composed of a little external contacts. SOLUTION: A contact pad 11 of at least one integrated circuit 1 is connected with a conductive projection 2 directly attached on a basic substrate. |
| 申请公布号 |
JP2002124597(A) |
申请公布日期 |
2002.04.26 |
| 申请号 |
JP20010287531 |
申请日期 |
2001.09.20 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
PAULUS STEFAN;AUBURGER ALBERT;HAINZ OSWALD;LANG DIETMAR;PETZ MARTIN;WEBER MICHAEL |
| 分类号 |
H01L23/12;H01L21/48;H01L21/56;H01L23/31 |
主分类号 |
H01L23/12 |
| 代理机构 |
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