发明名称 FLUXING MATERIAL FOR SOLDERING IN MASS SOLDERING MACHINE
摘要 The flux is free of halides, does not require cleaning after the soldering process. Its use is recommended where addition of flux is carried out by the formation of foam and where automatic feed of flux is done on the basis of density measurement with a density greater than 0.800 g/cm3>. The flux contains 0.01-20.00 wt. % of carbonic acid and/or rosin as activator, 0.01-5.00 wt. % of phthalic acid as foaming agent, 0.01-3.00 wt. % of chlorinated hydrocarbon and/or 1-methyl-2-pyrrolidone as spreadability and density increasing additives and 75-99 wt. % of alkanol mixture as carrier solution.
申请公布号 HU0004698(A2) 申请公布日期 2002.04.29
申请号 HU20000004698 申请日期 2000.11.23
申请人 MIHALYI JANOS;SZEKELY FERENC 发明人 MIHALYI JANOS
分类号 C08K5/00 主分类号 C08K5/00
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