| 摘要 |
PROBLEM TO BE SOLVED: To check various defects on the respective layers of substrate with high reliability. SOLUTION: This device is provided with an optical illumination system 10 with which an optical axis is arranged at an angleθi from 80 deg. to 89 deg. to a normal on the surface of wafer W, light receiving means 30 for receiving light containing information on the surface of wafer W illuminated by the optical illumination system 10, light reception angle setting means 40 for setting the light reception angle of light receiving means 30 in order to selectively receive prescribed light from the wafer W, and rotating mechanism 50 for rotating the wafer W around an axial line crossing the surface of wafer W. Since the optical axis of optical illumination system 10 is arranged at the angle closer to 90 deg. to the normal on the surface of wafer, most of illuminating light is reflected on the surface of wafer W, and the information on the surface of wafer W is mainly extracted.
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