| 摘要 |
PROBLEM TO BE SOLVED: To obtain a paste for adhesion of semiconductors that has low stress, excellent adhesion and thermal conductivity. SOLUTION: This thermally conductive paste comprises (A) an epoxy resin that is liquid at room temperature and bears 2 or more epoxy groups in one molecule, (B) a reactive diluent that has a viscosity of >=100 cps at room temperature and bears epoxy groups, (C) a crystalline phenolic compound represented by the formula (R is H or a 1-5C alkyl) and (D) silver powder. In this composition, the silver powder amounts to 70-90 wt.% based on the whole paste and >=30 wt.% of the whole powdery silver is atomized flake powdery having the longitudinal length distribution ranging from 10μm to 50μm and the perpendicular thickness distribution from 1μm to 5μm. The paste is prepared by previously melt-mixing the component C with the components A and B or mixing the component C with the component B, and then, with the component (D) or the components (D) and (A), respectively.
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