| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to apply a high voltage directly between two terminals, by connecting a voltage-dropping chip resistance in series to a semiconductor light emitting element, and inserting the semiconductor light emitting element and chip resistance in a transparent resin serving as a lens and package. SOLUTION: An anode terminal 1, cathode terminal 3 which is placed by the side thereof and conducted to the light emitting element 2 through a thin wire, and connecting terminal 5 placed by the other side of the anode terminal 1 of a semiconductor light emitting element composed of a p-n junction provided on a disk-like center top face are formed, and the terminal 1 is connected to the connecting terminal 5 through a chip resistance 6. The terminal 1, light emitting electric 2, terminals 4, 5 and chip resistance 6 are inserted in a transparent resin 7 for packaging. If a d-c voltage is applied between the terminals 3, 5, a voltage divided by the chip resistance 6 is applied to the light emitting element 2 and hence a high voltage can be applied directly between the terminals 3, 5 by adequately selecting the value of the chip resistance. |
