发明名称 |
Method for producing semiconductor device having increased adhesion between package and semiconductor chip bottom |
摘要 |
A method of manufacturing a semiconductor device which includes a semiconductor chip and a plastic package of a thermosetting polymer, including the steps of performing an ultraviolet cleaning process on the bottom surface of the semiconductor chip and, encapsulating the semiconductor chip through a molding process. The thermosetting polymer of the plastic package fully or partially covers the bottom surface of the semiconductor chip.
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申请公布号 |
US6383842(B1) |
申请公布日期 |
2002.05.07 |
申请号 |
US19980131367 |
申请日期 |
1998.08.07 |
申请人 |
FUJITSU LIMITED;KYUSHU FUJITSU ELECTRONIC |
发明人 |
TAKASHIMA AKIRA;SATO MITSUTAKA;TANIGUCHI SHINICHIROU |
分类号 |
H01L23/28;H01L21/304;H01L21/56;H01L23/495;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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