| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of difficulty in mounting electronic components having a terminal at the side and bottom to a recess, since the connection between a substrate and a circuit board is limited to wire bonding and the soldering of a conductive pattern on the surface of the substrate and the terminal, when the electronic components are to be mounted to the recessed part on the substrate. SOLUTION: A recess 20 is formed on a substrate 10, and conductive paste in filled in a substrate groove 13a at the bottom of the recess 20 and a substrate groove 13b at the side of the recess for forming a conductive material layer 18. The conductive material layer 18 is continuous to a conductive pattern 14a on the substrate surface and a conductive pattern 14b at the middle layer part of the substrate. A terminal 11 of the electronic component is soldered to the conductive material layer formed in the side substrate groove 13b, thus allowing the terminal to be continuous to the conductive patterns 14a and 14b of each layer on the substrate.
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