| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that many man-hours are taken because thin line bonding and thick line bonding are processed by separate processes since the conventional manufacturing method of a hybrid integrated circuit device is arranged in a process for attaching from small-sized parts to large-sized part in regular order. SOLUTION: The manufacturing method is provided with a process collectively mounting and melting circuit elements 4, 7, 11 fixed by at least an electrically conductive brazing material 3 to the desired electrically conductive path 2 of the hybrid integrated circuit board 1 and collectively processing the thin line and thick line bondings 9, 13 after the circuit element 6 fixed by a silver paste 5 on the electrically conductive path is mounted and fixed, particularly, the number of times of carrying of a soldering process and a bonding process is decreased by collectively processing the thin line and thick line bondings 9, 13, and the remarkable reduction of a carrying time and a working process is realized. |
