| 摘要 |
<p>PROBLEM TO BE SOLVED: To enlarge an operation area, and to eliminate the need for the etching of a transparent conductive film, to thereby improve the yield. SOLUTION: In a lower panel 1, the transparent conductive film 12 as a resistance film is formed on the whole upper face of a glass plate 11, and position detection electrodes 16a and 16b are formed at both end parts of the transparent conductive film 12 in X direction. In an upper panel 2, a transparent conductive film 22, being a resistance film, is formed on the whole lower face of a transparent resin film 21 and position detection electrodes 25a and 25b are formed on both end parts of the transparent conductive film 22 in Y direction. The transparent conductive films 12 and 22 are overlapped, so that they face each other via a prescribed gap. Leader wirings 25c and 25d for connecting them to an outer circuit are connected to the position detection electrodes 16a and 25a via through-holes 28a and 28b passing through the transparent resin film 21 and the transparent conductive film 22.</p> |
