| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an insulating sheet which does not discharge a silicon component. SOLUTION: A buffer layer 21 and a plastic film 23 are jointed with an adhesive layer 8 having no adhesiveness at room temperature to form the insulation sheet 13. Since a peeling film is not needed for forming the insulation sheet 13, a silicon component coated for peeling is not needed, which does not cause discharge of the silicon component. Therefore, when the insulating sheet is used on a printed circuit board, it does not damage the printed circuit board or an electronic circuit on the inside of a hard disk drive.</p> |
