| 摘要 |
PROBLEM TO BE SOLVED: To accomplish cost reduction and mass-production by preventing the use of a frame in manufacturing an IC card. SOLUTION: An IC module A is constructed by connecting a circuit board 1 on which an IC 2 is mounted to a coil 4 for data transmission and reception. The IC card is manufactured by making the face of the side where the IC 2 is mounted on the IC module A face a soft plastic sheet 6, embedding the IC module A into the plastic sheet 6 by heat pressing and laminating insulation hard sheets 7 and 8 and transparent protective sheets 9 and 10 on the both faces of the soft plastic sheet 6 where the IC module A is embedded to stick them onto the sheet 6 by heat pressing. |
