| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing which imparts good mold-releasability and good package appearances particularly to a thin package, and an electronic part device equipped with an element sealed with the same. SOLUTION: The epoxy resin molding material for sealing comprises, as essential ingredients, (A) an epoxy resin, (B) a curing agent, (C) a polyolefin release agent, and (D) a mixture of a compound represented by general formula (I) with a compound represented by general formula (II). The electronic part device is equipped with the element sealed with the same. In general formula (I), l, n and m are each 0 or a positive integer and R is a monovalent saturated or unsaturated hydrocarbon group. In general formula (II), l, n and m are each 0 or a positive integer and R is a monovalent saturated or unsaturated hydrocarbon group. COPYRIGHT: (C)2005,JPO&NCIPI |
