| 摘要 |
PROBLEM TO BE SOLVED: To prevent occurrence of air bubbles when hole filling resin is cured with which a through-hole is filled. SOLUTION: The through-hole 2 opened to both faces 1a and 1b of a substrate 1 is filled with hole filling resin 4 formed of photoresist (hole filling resin filling process). Hole filling resin is irradiated with light and is exposed in a state where a negative 5 patterned to shield light irradiation to a substrate surface 1a at a periphery of the through-hole 2 is installed, and hole filling resin 4 is cured. Thus, light energy more than required is prevented from being given to the substrate 1. Generation of heat (temperature rise) of the substrate 1 and occurrence of outgassing from hole filling resin 4 are controlled. Occurrence of the air bubbles can effectively be prevented at the time of curing hole filling resin 4. COPYRIGHT: (C)2006,JPO&NCIPI
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