发明名称 CONDUCTIVE FINE PARTICLES AND ANISOTROPIC CONDUCTIVE MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide conductive fine particles having excellent resin rejection property, a large connecting area with an electrode and excellent connection reliability, and to provide an anisotropic conductive material using the conductive fine particles when thermocompression bonding to an electrode with an anisotropic conductive film etc. SOLUTION: The conductive fine particles has base material fine particles whose surfaces are covered with conductive membranes and the conductive membranes have projections heaved on the surfaces. 70 to 90% of the surface areas of the conductive fine particles are covered with the heaved projections. The average height of the projection is preferably 2 to 10% of the average particle diameter of the conductive fine particles. The number percentage of the projections having projection height of 100-400 nm is preferably 80% or more. The number percentage of the projections having projection outer diameter is 100-400 nm is preferably 80% or more. In the anisotropic conductive material, the conductive fine particles are dispersed in a resin binder. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006228474(A) 申请公布日期 2006.08.31
申请号 JP20050038270 申请日期 2005.02.15
申请人 SEKISUI CHEM CO LTD 发明人 ISHIDA HIROYA
分类号 H01B5/00;H01B1/20;H01R11/01 主分类号 H01B5/00
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