发明名称 IC CARRIER WITH PLATE-LIKE FRAME BODY AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an IC carrier provided with a plate-like frame body capable of discriminating whether the IC carrier has been used or not. SOLUTION: The IC carrier 1 is provided with the plate-like frame body 8, an IC carrier 10 arranged on the aperture part 19 of the frame body 8 and an over sheet 6 for laminating the frame body 8 and the carrier 10. The frame body 8 has a core sheet 2 and a printing layer 3 formed on the core sheet 2 and the printing layer 3 of the frame body 8 is stuck close to the over sheet 6. The IC carrier 10 has the core sheet 2, the printing layer 3 formed on the core sheet 2 and a fusion interruption layer 5 partially formed on the printing layer 3. The layer 5 is arranged between the printing layer 3 of the carrier 10 and the over sheet 6.
申请公布号 JP2002140678(A) 申请公布日期 2002.05.17
申请号 JP20000331334 申请日期 2000.10.30
申请人 DAINIPPON PRINTING CO LTD 发明人 TAKEDA MITSUNORI
分类号 B42D15/10;G06K19/077;G06K19/10 主分类号 B42D15/10
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