| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering method which can suppress an occurrence of dewetting and bridging during flow soldering using a Sn-Zn based solder. SOLUTION: In the soldering method, a jet wave of a Sn-Zn based molten solder containing mainly Sn and Zn is spouted in a direction opposite to the transferring direction of the printed wiring board 1 to be transferred from a nozzle body 8, which has a slit type nozzle 14 with a fixed width stretching in a direction rectangular to a transferring direction of wiring board 1 and can rotate and adjust a position of the nozzle 14 in relation to the wiring board 1. The soldering is carried out by touching the jet wave on the bottom surface of the wiring board 1. In this case, an angleα, formed by a vertical line Y which passes the center of rotation of the nozzle body 8 and a line X which passes the center of rotation and an opening edge (an upper end edge) 12a of the nozzle 14 located in the lower stream side of the transferring direction of the wiring board 1, is kept in a state adjusted, taking the vertical line Y as a base, between 0 degree and 5 degree or less to the upper stream side in the transferring direction of the wiring board 1, and then the flow soldering is performed by the jet wave spouted from the nozzle 14. COPYRIGHT: (C)2007,JPO&INPIT |
